Monday, 29 April 2019

The Industrial Lubricants Market is Evolving with Sustainable Driving Forces

1. The industrial lubricants industry, particularly in Asia, is reshaping its supply channels and marketing strategies. 

2. Over the past five years, greater internet penetration among the region’s populations has brought about a tremendous growth in online retail usage, wherein lubricant marketers are finding a viable retail platform.

Sunday, 21 April 2019

Product Spotlight - Powder Coatings

1. No matter whether you’re using a single gun and small oven or a large fully automated line, the process is basically the same. 

2. A powder spray gun is used, which when triggered gives an electrostatic charge to the powder particles passing through it. 

3. As the parts to be coated are grounded, the powder is attracted towards the part via the electrostatic process.

4. Once the powder is applied the parts are cured in an oven, which melts and cross-links the powder over the surface of the part and creates a tough, scratch resistant and beautiful finish.

Sunday, 14 April 2019

Product Spotlight - Metal Additive Manufacturing

1. There are 2 main families of additive manufacturing technologies

2. Powder bed technologies

- Selective Laser Melting (SLM) where the metal powder is melted by a laser beam

- Electron Beam Melting (EBM) where the metal powder is melted by an electron beam after a preheating step

- Precision inkjet printing where the metal powder is mixed with a binder: after the printing operation, the part is consolidated by sintering.

3.  Blown powder technologies, also known as Laser Metal Deposition or Laser cladding
In this process, the metal powder is blown coaxially to the laser beam which melts the particles on a base metal to form a metallurgical bond when cooled.

Monday, 1 April 2019

Product Spotlight - Silicon Wafers Cleaning - RCA Cleaning & Piranha Solution

1. The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing.

2. It involves the following chemical processes performed in sequence:

- Removal of the organic contaminants (organic clean + particle clean)
- Removal of thin oxide layer (oxide strip, optional)
- Removal of ionic contamination (ionic clean)