1. As AI data centers' computing power demands continue to climb, traditional copper interconnect technology is approaching its physical limits. Co-packaged optics (CPO) is being touted as a key interconnect solution for next-generation AI infrastructure. However, just as Taiwan Semiconductor Manufacturing Co. (TSMC) prepares to mass-produce chips using its COUPE platform in 2026, a long-overlooked step in the process is becoming a critical bottleneck across the entire supply chain: testing.
